D30 30μm Diamond Lapping Film – Epoxy Removal for Fiber Optic Connector Polishing

D30 30μm Diamond Lapping Film – Epoxy Removal for Fiber Optic Connector Polishing

What is D30 30μm Diamond Lapping Film?

The D30 30μm diamond lapping film is a high-performance abrasive film engineered for epoxy removal in fiber optic connector polishing. It utilizes a 30-micron diamond grit, precision-coated on a polyester backing, to aggressively and uniformly cut hardened epoxy materials during the initial stage of the polishing process.

This film is part of a multi-step polishing workflow for MTP/MPO, LC, SC, ST, and APC connectors in single-mode and multimode applications. It is often the first polishing film used, setting the foundation for a clean, defect-free fiber endface.

Key Technical Specifications

Why Use 30μm Grit for Epoxy Removal?

Epoxy removal is a critical step in fiber optic polishing because excess cured epoxy can cause fiber endface defects, interfere with ferrule geometry, and reduce optical performance.

The 30μm grit size offers:

• Aggressive stock removal of epoxy and ferrule surface contaminants

• Reduced polishing time per connector batch

• Controlled material removal to prevent fiber undercutting

• Consistency across multiple connectors, critical for high-volume polishing environments

Application in Fiber Optic Connector Polishing

1. Epoxy Dome Removal

When fiber is cleaved and epoxied into the ferrule, a "dome" of excess epoxy remains. The D30 30μm film efficiently removes this dome without damaging the surrounding ferrule or fiber.

2. Initial Ferrule Surface Flattening

The abrasive also flattens the ferrule endface, preparing it for finer polishing films (like 9μm, 3μm, and 0.5μm).

3. Use with Polishing Fixtures and Machines

The D30 film is compatible with automated and manual polishing machines. It's often used in combination with:

• Rubber or glass pads (compliance layer)

• Controlled pressure polishing fixtures (UPC/APC polish)

• Wet or dry polishing techniques (usually dry for epoxy removal)

Comparison with Other Grit Sizes

Using the correct grit sequence is essential for meeting IEC and Telcordia standards for fiber optic endface geometry and performance (e.g., apex offset, radius of curvature, and fiber height).

Advantages of D30 30μm Diamond Film

• Durability: Diamond abrasives outperform silicon carbide and aluminum oxide in lifespan.

• Precision: Coated evenly with micron-graded diamond particles for uniform performance.

• Flatness: Ensures consistent polishing with minimal film deformation.

• Cleaner Process: Generates less debris and swarf than traditional abrasives.

Industries and Use Cases

• Telecommunications and Data Centers: MPO/MTP connector polishing for high-density backplanes.

• Fiber Optic Patchcord Manufacturers: High-throughput, low-defect-rate production.

• Field Repair Kits (with caution): Some field repair setups include coarse films for epoxy touch-ups.

• R&D Labs and QA Environments: Used in prototyping and endface geometry inspection processes.

Best Practices for Using D30 30μm Film

• Use with a flat, clean polishing plate to avoid surface irregularities.

• Clean connector ferrules before polishing to avoid particle embedment.

• Monitor usage count: Replace film after ~50–100 connectors or when cutting efficiency drops.

• Label each film use zone (center vs edge) to balance wear patterns on large discs.

Where to Buy

You can find D30 30μm diamond lapping films from trusted fiber optic polishing supplier like XYT, visit www.polishingfilm.com or contact sales@xytbrands.com 

Be sure to match the film with your polishing fixture, machine, and connector type for optimal results.

Conclusion

The D30 30μm diamond lapping film is the cornerstone of an effective fiber optic polishing workflow. Its aggressive yet controlled cutting action makes it ideal for fast, clean epoxy removal, helping you achieve the quality required for next-gen optical networks.

If you're setting up or optimizing your polishing line, the right use of D30 film could significantly improve production throughput, connector performance, and compliance with industry standards.